New Thermal Material Provides 72% Better Cooling Than Conventional Paste (techspot.com)
- Reference: 0175458927
- News link: https://hardware.slashdot.org/story/24/11/12/2228231/new-thermal-material-provides-72-better-cooling-than-conventional-paste
- Source link: https://www.techspot.com/news/105537-new-thermal-material-provides-72-better-cooling-than.html
> Thanks to a mechanochemically engineered combination of the liquid metal alloy Galinstan and ceramic aluminum nitride, this thermal interface material, or TIM, outperformed the best commercial liquid metal cooling products by a staggering 56-72% in lab tests. It allowed dissipation of up to 2,760 watts of heat from just a 16 square centimeter area. The material pulls this off by bridging the gap between the theoretical heat transfer limits of these materials and what's achieved in real products. Through mechanochemistry, the liquid metal and ceramic ingredients are mixed in an extremely controlled way, creating gradient interfaces that heat can flow across much more easily.
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> Beyond just being better at cooling, the researchers claim that the higher performance reduces the energy needed to run cooling pumps and fans by up to 65%. It also unlocks the ability to cram more heat-generating processors into the same space without overheating issues. [...] As for how you can get your hands on the material: it's yet to make it out of the labs. The UT team has so far only tested it successfully at small scales but is now working on producing larger batches to put through real-world trials with data center partners.
The material has been detailed in a paper [3]published in the journal Nature Nanotechnology .
[1] https://www.techspot.com/news/105537-new-thermal-material-provides-72-better-cooling-than.html
[2] https://slashdot.org/~jjslash
[3] https://www.nature.com/articles/s41565-024-01793-0
Yes, but... (Score:1)
Can kindergartners eat it?
Re: (Score:2)
Anything is edible, once.
Does not matter in most cases (Score:2)
Thermal interface material on semiconductors drawing a lot of power is generally thin enough that this does not matter. It matters even less when there is a heat-spreader. Well, Intel has screwed thermal paste up in the past on some CPUs, but that is an anomaly.
Cool (Score:2)
That's cool
Galinstan (Score:2)
Don't bother. Trump said this was a shit hole country.
$750 per kg (Score:2)
[1]https://unitednuclear.com/chem... [unitednuclear.com]
6.44 grams/cc.
So 155 ml per kg. Or 6.44 kg/liter.
[1] https://unitednuclear.com/chemicals-metals-c-69/liquid-metal-alloy-gallium-indium-tin-p-1354.html
Re: (Score:2)
Most LM compounds used in exotic PC cooling setups cost about the same. The Thermal Grizzly stuff is quite expensive (Conductonaut).
Re: (Score:2)
Still a bargain compared to printer ink!
Bargain compared to printer ink from HP (Score:2)
Also $700 per liter which is about a kg.
Where are the "Laws of Thermodynamics" guys? (Score:2)
You shout always "Laws of Thermodynamics" and are usually wrong.
Now you could shout but you do not ...
So, this "cooling method" makes it easier to cool a motherboard.
And? Where is the heat going?
Obviously into the room/hall of the data center.
It does not affect cooling costs at the slightest. For that you would need fancy set ups, like blowing a lot of "normal air" through the data center to blow the hot air out.
If you just cool the data center as usual: this tech makes no difference.
But at home in a Pc it
Re: (Score:2)
> It does not affect cooling costs at the slightest.
Not actually true. With this material you might get away with a slightly higher temperature in the DC, which means better heat pumping efficiency. Obviously that is only for the CPU and hence will not matter at all.
Re: (Score:2)
What makes you think it would not matter for the GPUs where the real heat is made? Thermally, the only difference between those and a monster CPU is that the magic silicon that plugs into an SXM socket doesn't have metal armor over it like a CPU.
Saw this elsewhere (Score:2)
They are going to larger real world trials soon. I hope to see more info on this product based on these tests. I hope we see degradation and longevity data on it, that is what im looking for personally.
Re: (Score:2)
I have a hard time understanding how a better TIM is going to reduce pump energy usage by over half.
I guess you could say that if the thermal resistance is lower then for the same core temperature you would have a higher heat sink temperature. Which would mean that delta T between the heatsink and the cooling medium could be higher so to remove the same amount of heat the flow rate could be lower assuming everything else (e.g. heatsink size) is constant. But 65% savings still seems like a lot.
Re:Saw this elsewhere (Score:4, Informative)
If the heat gradient needed to move heat from the die into the heatsink is less, the heat gradient from the heatsink to the air or liquid coolant can be more which means their fans/pumps can run slower.
And if you've ever seen the ratings stamps on modern server fans, you'll see why reducing their power consumption would matter. Example: Supermicro AS-4145 2U box has a bank of eight 2U height fans pushing air in... each one of them is rated to draw over 50W of power at maximum speed. So when the server's gas pedal is to the floor (which for a quad MI-300a system is around 2500W) nearly 10% of system power dissipation is the fans.
It's even worse for 1U systems because those tiny ass little fans are grossly inefficient.