Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops
([Hardware] 5 October 06:04 AM EDT
Linux Patches)
A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support. Some Qualcomm SoCs are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon. The new Linux patches are working to properly convey that information around the thermal limits for a given piece of silicon.